cystech electronics corp. spec. no. : c208m3 issued date : 2013.11.20 revised date : page no. : 1/6 QEM3 cystek product specification 1a/200v snubber damping rectifier QEM3 features ? high current capability ? smoothly soft reverse recovery time (trr) ? low profile surface mounted package in order to minimize board space ? pb-free lead plating and halogen-free package symbol outline ordering information device package shipping QEM3-0-t2-g sot-89 (pb-free lead plating and halogen-free package) 1000 pcs / tape & reel QEM3 sot-89 a k n a anode k cathode n not connected environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t2 :1000 pc s/tape & reel, 7? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c208m3 issued date : 2013.11.20 revised date : page no. : 2/6 QEM3 cystek product specification absolute maximum ratings (t a =25 , unless otherwise noted) parameters conditions symbol value units repetitive peak reverse voltage v rrm 200 v rms voltage v rms 140 v continuous reverse voltage v r 200 v forward rectified current single phase half wave, 60hz @t j =25 c i f(av) 1 a repetitive peak forward current single phase half wave, 60hz @t j =25 c i frm 1.57 a forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) i fsm 6 a 0.6 (note 1) 1 power dissipation (note 2) p d 2 w maximum reverse recovery time i f =0.5a, i r =1.0a, rr =0.25a trr 500 ns storage temperature range tstg -55~+150 c operating junction temperature range tj -55~+150 c note: *1 when mounted on fr-4 pcb with area measuring 10101 mm *2 when mounted on ceramic with area measuring 40401 mm characteristics (t a =25 c, unless otherwise noted) characteristic symbol condition min. typ max. unit reverse voltage v r i r =100 a 200 - - v v f 1 i f =100ma - - 0.95 forward voltage v f 2 i f =500ma - - 1.2 v i r v r =200v - - 100 na reverse leakage current i r v r =200v, t a =125c - - 1 a junction capacitance c j v r =1v, f=1mhz - 2.9 - pf
cystech electronics corp. spec. no. : c208m3 issued date : 2013.11.20 revised date : page no. : 3/6 QEM3 cystek product specification typical characteristics power derating curves 0 0.5 1 1.5 2 2.5 0 50 100 150 200 ambient temperature ---ta( ) power dissipation---pd(w) see note 2 on page 1 see note 1 on page 1 forward current vs forward voltage 1 10 100 1000 10000 0 0.2 0.4 0.6 0.8 1 1.2 1.4 forward voltage---v f (v) instantaneous forward current---i f (ma) pulse width=300s, 1% duty cycle 0 125 -40c 25c 75c reverse leakage current vs reverse voltage 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 160 180 200 reverse voltage---v r (v) reverse leakage current---i r (na) tj=75 tj=25 tj=125 junction capacitance vs reverse voltage 0.1 1 10 0.1 1 10 100 reverse voltage---v r (v) junction capacitance---c j (pf) tj=25, f=1.0mhz recommended soldering footprint
cystech electronics corp. spec. no. : c208m3 issued date : 2013.11.20 revised date : page no. : 4/6 QEM3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c208m3 issued date : 2013.11.20 revised date : page no. : 5/6 QEM3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c208m3 issued date : 2013.11.20 revised date : page no. : 6/6 QEM3 cystek product specification sot-89 dimension *: typical inches marking: millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1732 0.1811 4.40 4.60 f 0.0583 0.0598 1.48 1.527 b 0.1594 0.1673 4.05 4.25 g 0. 1165 0.1197 2.96 3.04 c 0.0591 0.0663 1.50 1.70 h 0.0551 0.0630 1.40 1.60 d 0.0945 0.1024 2.40 2.60 i 0.0138 0.0161 0.35 0.41 e 0.01417 0.0201 0.36 0.51 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated. ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . qe e f g c b a 3 2 1 i d h 3-lead sot-89 plastic surface mounted package cystek package code: m3 style: pin 1. anode 2. cathode 3. not connected product code month code: 1~9, a,b,c year code: 02010, 1 2011, 22012, ?etc.
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